1. 2. 3. material content data sheet sales product name ipp020n06n issued 29. august 2013 ma# MA000963518 package pg-to220-3-1 weight* 2065.00 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 26.819 1.30 1.30 12987 12987 leadframe non noble metal iron 7439-89-6 0.816 0.04 395 inorganic material phosphorus 7723-14-0 0.245 0.01 119 non noble metal copper 7440-50-8 815.335 39.48 39.53 394836 395350 wire non noble metal aluminium 7429-90-5 11.242 0.54 0.54 5444 5444 encapsulation organic material carbon black 1333-86-4 8.478 0.41 4105 plastics epoxy resin - 93.253 4.52 45159 inorganic material silicondioxide 60676-86-0 463.441 22.44 27.37 224427 273691 leadfinish non noble metal tin 7440-31-5 21.462 1.04 1.04 10393 10393 plating non noble metal nickel 7440-02-0 0.244 0.01 118 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 118 solder noble metal silver 7440-22-4 0.836 0.04 405 non noble metal tin 7440-31-5 0.669 0.03 324 non noble metal lead 7439-92-1 31.925 1.55 1.62 15460 16189 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 86 non noble metal iron 7439-89-6 0.590 0.03 286 non noble metal copper 7440-50-8 589.466 28.55 28.59 285456 285828 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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